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Most motion sensors in the market today are based on MEMS (Micro Electro Mechanical System) multi-chip module technology developed in the 1980’s. In this approach, the mechanical (MEMS) chip is fabricated on a specialized process, generally in a completely different fabrication facility as the drive electronics (IC) chip. The two chips are then separately tested and wired together in a package as a multi-chip module (MCM).

The disadvantages of this approach include the size and cost of two chips, the cost and capacity constraints of specialized MEMS fabrication and the performance limitations of interconnecting two separate chips into a single package.

mCube has developed a unique single-chip approach for designing and fabricating extremely cost-effective, high performance motion sensors. In the mCube approach, the MEMS elements are monolithically fabricated on top of the drive IC in a standard CMOS fabrication facility. Advantages include lower cost, smaller size, higher performance and the ability to integrate multiple sensors on a single-chip. Additionally, due to mCube’s fast cycle time design approach, products can be quickly customized and optimized for specific market requirements.

mCube single-chip 3D silicon MEMS cross-section

mCube single-chip 3D silicon MEMS

mCube Technology Benefits

Feature Advantages
Monolithic MEMS on CMOS IC Single chip vs. MCM
Best multi-sensor integration platform
Compatible with fabless model
Enables rapid product customization
MEMS in CMOS fab MEMS with CMOS process control
Lower cost, manufacturability
Thick silicon MEMS Improved signal/noise, lower power
In-silicon electrical contacts Performance, lower parasitics
MEMS hermetically sealed Improved performance and reliability
Simplified test and assembly Fewer die to probe and assemble, lower cost
Smaller package size with fewer die Smaller end product form factors